Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages

• Main Authors: Ghulam, Abdul Quadir, Prof. Dr., Leong, C.B., Krishnan, G.M., Seetharamu, Kankanhally N.
• Other Authors: [e-mail]
• Format: Working Paper
• Language: English
• Published: IEEE Conference Publications 2014
• Subjects: Design conditions; Dielectric fluid; Dielectric vapour; Dielectric vapour flow; Electronic package; Electronic components
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33931

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