Numerical evaluation of adhesive bonding quality using electromechanical impedance technique
A joint is a crucial approach in the engineering field, especially when it comes to the completion of a structure. Engineers must inspect the structure's quality so that damage can be avoided. Many academic and industry researchers have recently expressed interest in the creation of a real-t...
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Online Access: | http://irep.iium.edu.my/114088/3/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality_SCOPUS.pdf http://irep.iium.edu.my/114088/4/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality.pdf http://irep.iium.edu.my/114088/ https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219/5322 https://doi.org/10.37934/aram.120.1.122135 |
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my.iium.irep.1140882024-08-27T04:28:44Z http://irep.iium.edu.my/114088/ Numerical evaluation of adhesive bonding quality using electromechanical impedance technique Ahmed, Zaheer Hrairi, Meftah Yazid, Zakwan TA349 Mechanics of engineering. Applied mechanics TH3301 Maintenance and repair TJ212 Control engineering A joint is a crucial approach in the engineering field, especially when it comes to the completion of a structure. Engineers must inspect the structure's quality so that damage can be avoided. Many academic and industry researchers have recently expressed interest in the creation of a real-time, in-service, and smart material-based Structural health monitoring (SHM) technique. Recently, piezoceramic (PZT) transducers have developed into an effective smart material that is frequently used in guided ultrasonic wave propagation and electromechanical impedance (EMI) procedures. This paper will investigate the adhesive bonded structure with the presence of stiffener and lap joint in good and damaged condition. ANSYS software will be used to develop a finite element model to determine the impedance signal of the structure and validate the simulation results with results from the literature. The result will be shown in terms of impedance signal and the differences in the condition will be determined by RMSD value Semarak Ilmu Publishing 2024-08-01 Article PeerReviewed application/pdf en http://irep.iium.edu.my/114088/3/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality_SCOPUS.pdf application/pdf en http://irep.iium.edu.my/114088/4/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality.pdf Ahmed, Zaheer and Hrairi, Meftah and Yazid, Zakwan (2024) Numerical evaluation of adhesive bonding quality using electromechanical impedance technique. Journal of Advanced Research in Applied Mechanics, 120 (1). pp. 122-135. ISSN 2289-7895 https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219/5322 https://doi.org/10.37934/aram.120.1.122135 |
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TA349 Mechanics of engineering. Applied mechanics TH3301 Maintenance and repair TJ212 Control engineering Ahmed, Zaheer Hrairi, Meftah Yazid, Zakwan Numerical evaluation of adhesive bonding quality using electromechanical impedance technique |
description |
A joint is a crucial approach in the engineering field, especially when it comes to the
completion of a structure. Engineers must inspect the structure's quality so that
damage can be avoided. Many academic and industry researchers have recently
expressed interest in the creation of a real-time, in-service, and smart material-based
Structural health monitoring (SHM) technique. Recently, piezoceramic (PZT)
transducers have developed into an effective smart material that is frequently used in
guided ultrasonic wave propagation and electromechanical impedance (EMI)
procedures. This paper will investigate the adhesive bonded structure with the
presence of stiffener and lap joint in good and damaged condition. ANSYS software will
be used to develop a finite element model to determine the impedance signal of the
structure and validate the simulation results with results from the literature. The result
will be shown in terms of impedance signal and the differences in the condition will be
determined by RMSD value |
format |
Article |
author |
Ahmed, Zaheer Hrairi, Meftah Yazid, Zakwan |
author_facet |
Ahmed, Zaheer Hrairi, Meftah Yazid, Zakwan |
author_sort |
Ahmed, Zaheer |
title |
Numerical evaluation of adhesive bonding quality using electromechanical impedance technique |
title_short |
Numerical evaluation of adhesive bonding quality using electromechanical impedance technique |
title_full |
Numerical evaluation of adhesive bonding quality using electromechanical impedance technique |
title_fullStr |
Numerical evaluation of adhesive bonding quality using electromechanical impedance technique |
title_full_unstemmed |
Numerical evaluation of adhesive bonding quality using electromechanical impedance technique |
title_sort |
numerical evaluation of adhesive bonding quality using electromechanical impedance technique |
publisher |
Semarak Ilmu Publishing |
publishDate |
2024 |
url |
http://irep.iium.edu.my/114088/3/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality_SCOPUS.pdf http://irep.iium.edu.my/114088/4/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality.pdf http://irep.iium.edu.my/114088/ https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219/5322 https://doi.org/10.37934/aram.120.1.122135 |
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13.1944895 |