Numerical evaluation of adhesive bonding quality using electromechanical impedance technique
A joint is a crucial approach in the engineering field, especially when it comes to the completion of a structure. Engineers must inspect the structure's quality so that damage can be avoided. Many academic and industry researchers have recently expressed interest in the creation of a real-t...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English English |
| Published: |
Semarak Ilmu Publishing
2024
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/114088/3/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality_SCOPUS.pdf http://irep.iium.edu.my/114088/4/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality.pdf http://irep.iium.edu.my/114088/ https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219/5322 https://doi.org/10.37934/aram.120.1.122135 |
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| Summary: | A joint is a crucial approach in the engineering field, especially when it comes to the
completion of a structure. Engineers must inspect the structure's quality so that
damage can be avoided. Many academic and industry researchers have recently
expressed interest in the creation of a real-time, in-service, and smart material-based
Structural health monitoring (SHM) technique. Recently, piezoceramic (PZT)
transducers have developed into an effective smart material that is frequently used in
guided ultrasonic wave propagation and electromechanical impedance (EMI)
procedures. This paper will investigate the adhesive bonded structure with the
presence of stiffener and lap joint in good and damaged condition. ANSYS software will
be used to develop a finite element model to determine the impedance signal of the
structure and validate the simulation results with results from the literature. The result
will be shown in terms of impedance signal and the differences in the condition will be
determined by RMSD value |
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