Numerical evaluation of adhesive bonding quality using electromechanical impedance technique

A joint is a crucial approach in the engineering field, especially when it comes to the completion of a structure. Engineers must inspect the structure's quality so that damage can be avoided. Many academic and industry researchers have recently expressed interest in the creation of a real-t...

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Bibliographic Details
Main Authors: Ahmed, Zaheer, Hrairi, Meftah, Yazid, Zakwan
Format: Article
Language:English
English
Published: Semarak Ilmu Publishing 2024
Subjects:
Online Access:http://irep.iium.edu.my/114088/3/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality_SCOPUS.pdf
http://irep.iium.edu.my/114088/4/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality.pdf
http://irep.iium.edu.my/114088/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219/5322
https://doi.org/10.37934/aram.120.1.122135
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